JPH081052Y2 - 導光体成形型 - Google Patents
導光体成形型Info
- Publication number
- JPH081052Y2 JPH081052Y2 JP1990006978U JP697890U JPH081052Y2 JP H081052 Y2 JPH081052 Y2 JP H081052Y2 JP 1990006978 U JP1990006978 U JP 1990006978U JP 697890 U JP697890 U JP 697890U JP H081052 Y2 JPH081052 Y2 JP H081052Y2
- Authority
- JP
- Japan
- Prior art keywords
- light guide
- light
- guide plate
- mold
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 10
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990006978U JPH081052Y2 (ja) | 1990-01-26 | 1990-01-26 | 導光体成形型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990006978U JPH081052Y2 (ja) | 1990-01-26 | 1990-01-26 | 導光体成形型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0398020U JPH0398020U (en]) | 1991-10-09 |
JPH081052Y2 true JPH081052Y2 (ja) | 1996-01-17 |
Family
ID=31510645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990006978U Expired - Lifetime JPH081052Y2 (ja) | 1990-01-26 | 1990-01-26 | 導光体成形型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH081052Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101462280B1 (ko) * | 2008-06-13 | 2014-11-19 | 삼성전자주식회사 | 휴대용 전자 기기 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53102366A (en) * | 1977-02-18 | 1978-09-06 | Fukuyama Seimitsu Kosakusho:Kk | Metal mold for molding resin |
JPS5519919U (en]) * | 1978-07-19 | 1980-02-07 | ||
JPS5817957A (ja) * | 1981-07-21 | 1983-02-02 | 株式会社ナカ技術研究所 | 構造物に使用されるパラペツト笠木 |
JPS5825405U (ja) * | 1981-08-13 | 1983-02-18 | 積水化学工業株式会社 | パネルの接続部 |
JPS6058695A (ja) * | 1983-09-12 | 1985-04-04 | Nec Corp | 埋め込み型半導体レ−ザ素子の製造方法 |
-
1990
- 1990-01-26 JP JP1990006978U patent/JPH081052Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0398020U (en]) | 1991-10-09 |
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